Adhesives Technology for Electronic Applications: Materials, Processing, Reliability

This second book in the Materials and Processes for Electronic Applications Series (James J. Licari, ed.) is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as U.V., microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of data on properties, performance, and reliability. Also included are examples of commercially available adhesives, suppliers, and equipment. Each chapter provides comprehensive references.

Each book in the Materials and Processes for Electronic Applications Series provides theoretical foundations and practical data useful to electronics design engineers, process engineers, manufacturing engineers, quality assurance and reliability engineers, materials scientists, and polymer chemists as they strive to achieve ever more demanding electronics product features. These interdisciplinary books bridge gaps between electronics engineers and materials engineers important in advancing the state of the art. Applications cover the major industries: automotive, medical, semiconductors, space, and military.